Patterned surfaces for photonic applications

Patterned surfaces for photonic applications

TDI announces its technology for producing microstructured surfaces.  TDI’s proprietary processes enable patterned surfaces across wafer and panel substrates at micron and nanometer dimensions. Both etched and polymeric microstructures are viable for structures consistent with photonic applications. The patterning and transfer processes are developed for multiple structures including dense lines, arrays of holes and pillars, and mixed designs. The technology is offered for patterning polymeric sheets and thin films.