eMxL-2G Integrated Patterning and Etch System

TDI provides ICP plasma etch equipment to Gen 2 substrates (370 mm x 470 mm), that is optimized for the molecular transfer lithography patterning technology so as to achieve a comprehensive nanopatterning integrated solution.  The molecular transfer lithography technology after dissolution of the PVA template is presented to the etching station and a set of plasma etch recipes are used to etch into the underlying thin films with a high degree of anisotropy and selectivity to achieve sub-20nm features at high aspect ratios in metal, dielectric and semiconductor thin films.

Etch equipment