Molecular Transfer Solution (Patents include 6,849,558 and 7,345,002)


Complete Molecular Transfer Solution

Coordinated within a single integrated platform for advanced nanopatterning, TDI's nanopatterning solution involves a process decomposition into the generation of functionalized templates at an efficient production facility and the subsequent adhesion of the functionalized material onto the target substrates at the in-line manufacturing facility, both of which are enabled with TDI's products and services.






After receiving the design layout information from the customer, to produce functionalized templates, TDI processes the information by having the software design converted into an advanced photomask, which is used to pattern a master in silicon, followed by a replication step that uses the master to generate PVA templates in volume, which are individually functionalized with resist or other target materials to form fPVA templates that are shipped to the customer on order.


To produce a patterned substrate upon delivery of the fPVA templates from TDI, the customer simply uses the exaGlide 10 tooling to directly adhere the functional side of the fPVA template to the substrate, followed by an optional bake step, and then dissolves away the template in water to reveal the patterned wafer, ready for the next operation or as the final part. Using one fPVA template per wafer processed, this series of steps is repeated to produce wafers with high resolution features at low costs in volume manufacturing.

Advantages

»  High performance patterning with all of the advantages of the MxL processing technique
»  Dry processing that eliminates the need for the customer to spin-coat and handle photoresist
»  Low-cost customer tooling that uses a large-area lamination procedure for high throughputs
»  Turn-key operations, including the generation, qualification, and process control of the master
»  Adaptable to multiple patterns and substrates, providing flexibility for lab and pilot applications

 

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