Large area processing of nanostructures
Processing of large area substrates, greater than 300mm, is one advantage of the use of the soluble templates for high resolution patterning, which after pattern formation is removed by simple water dissolution. Consequently, the forces involved are significantly reduced of both conformal materials formation or separation of the template from the transferred materials, which is accomplished chemically. Thereby, the technology enables patterning of high resolution structures, which can be sequently processed, across large areas.
TDI technology enables the patterning across 24” diagonal substrates with 50nm features with the following variation of both silicon and metallic grating structures.
Dissolvable template integrated with functional materials and equipment
Coordinated within a single integrated platform for advanced nanopatterning, TDI’s nanopatterning solution involves a process decomposition into the generation of functionalized templates at an efficient production facility and the subsequent adhesion of the functionalized material onto the target substrates at the in-line manufacturing facility, both of which are enabled with TDI’s products and services.
After receiving the design layout information from the customer, to produce functionalized templates, TDI processes the information by having the software design converted into an advanced photomask, which is used to pattern a master in silicon, followed by a replication step that uses the master to generate PVA templates in volume, which are individually functionalized with resist or other target materials to form functional PVA templates that are shipped to the customer on order, or used internally at TDI.
To produce a patterned substrate upon delivery of the PVA templates from TDI, the customer simply uses TDI Equipment to directly adhere the functional side of the PVA template to the substrate, followed by an optional bake step, and then dissolves away the template in water to reveal the patterned wafer, ready for the next operation or as the final part. Using one PVA template per wafer processed, this series of steps is repeated to produce wafers with high resolution features at low costs in volume manufacturing.
- High performance patterning with all of the advantages of the MxL processing technique
- Dry processing that eliminates the need for the customer to spin-coat and handle photoresist
- Low-cost customer tooling that uses a large-area lamination procedure for high throughputs
- Turn-key operations, including the generation, qualification, and process control of the master
- Adaptable to multiple patterns and substrates, providing flexibility for lab and pilot applications